Deze pagina overloopt alle fabs in de wereld waar er momenteel chips worden gemaakt, op voorwaarde dat deze fab gekend is op wikipedia.
Er zijn momenteel 488 werkende chip fabs gekend.
['Company', 'Plant Name', 'Plant Location', 'Plant Cost (in US$ billions)', 'Started Production', 'Wafer Size (mm)', 'Process Technology Node (nm)', 'Production Capacity (Wafers/Month)', 'Technology / Products']
[{'Company': UMC - He Jian,
'Plant Name': Fab 8N,
'Plant Location': China China,
'Plant Cost (in US$ billions)': 0.750, 1.2, +0.5,
'Started Production': 2003, May,
'Wafer Size (mm)': 200,
'Process Technology Node (nm)': 4000–1000, 500, 350, 250, 180, 110,
'Production Capacity (Wafers/Month)': 77000,
'Technology / Products': Foundry},
{'Company': UMC,
'Plant Name': Fab 6A,
'Plant Location': Taiwan Taiwan , Hsinchu,
'Plant Cost (in US$ billions)': 0.35,
'Started Production': 1989,
'Wafer Size (mm)': 150,
'Process Technology Node (nm)': 450,
'Production Capacity (Wafers/Month)': 31000,
'Technology / Products': Foundry},
{'Company': UMC,
'Plant Name': Fab 8AB,
'Plant Location': Taiwan Taiwan , Hsinchu,
'Plant Cost (in US$ billions)': 1,
'Started Production': 1995,
'Wafer Size (mm)': 200,
'Process Technology Node (nm)': 250,
'Production Capacity (Wafers/Month)': 67000,
'Technology / Products': Foundry},
{'Company': UMC,
'Plant Name': Fab 8C,
'Plant Location': Taiwan Taiwan , Hsinchu,
'Plant Cost (in US$ billions)': 1,
'Started Production': 1998,
'Wafer Size (mm)': 200,
'Process Technology Node (nm)': 350–110,
'Production Capacity (Wafers/Month)': 37000,
'Technology / Products': Foundry},
{'Company': UMC,
'Plant Name': Fab 8D,
'Plant Location': Taiwan Taiwan , Hsinchu,
'Plant Cost (in US$ billions)': 1.5,
'Started Production': 2000,
'Wafer Size (mm)': 200,
'Process Technology Node (nm)': 90,
'Production Capacity (Wafers/Month)': 31000,
'Technology / Products': Foundry},
{'Company': UMC,
'Plant Name': Fab 8E,
'Plant Location': Taiwan Taiwan , Hsinchu,
'Plant Cost (in US$ billions)': 0.96,
'Started Production': 1998,
'Wafer Size (mm)': 200,
'Process Technology Node (nm)': 180,
'Production Capacity (Wafers/Month)': 37000,
'Technology / Products': Foundry},
{'Company': UMC,
'Plant Name': Fab 8F,
'Plant Location': Taiwan Taiwan , Hsinchu,
'Plant Cost (in US$ billions)': 1.5,
'Started Production': 2000,
'Wafer Size (mm)': 200,
'Process Technology Node (nm)': 150,
'Production Capacity (Wafers/Month)': 40000,
'Technology / Products': Foundry},
{'Company': UMC,
'Plant Name': Fab 8S,
'Plant Location': Taiwan Taiwan , Hsinchu,
'Plant Cost (in US$ billions)': 0.8,
'Started Production': 2004,
'Wafer Size (mm)': 200,
'Process Technology Node (nm)': 350–250,
'Production Capacity (Wafers/Month)': 31000,
'Technology / Products': Foundry},
{'Company': UMC,
'Plant Name': Fab 12A,
'Plant Location': Taiwan Taiwan , Tainan,
'Plant Cost (in US$ billions)': 4.65, 4.1, 6.6, 7.3,
'Started Production': 2001, 2010, 2014, 2017,
'Wafer Size (mm)': 300,
'Process Technology Node (nm)': 28, 14,
'Production Capacity (Wafers/Month)': 87000,
'Technology / Products': Foundry},
{'Company': UMC,
'Plant Name': Fab 12i,
'Plant Location': Singapore Singapore,
'Plant Cost (in US$ billions)': 3.7,
'Started Production': 2004,
'Wafer Size (mm)': 300,
'Process Technology Node (nm)': 130–40,
'Production Capacity (Wafers/Month)': 53000,
'Technology / Products': Foundry}]
[28, 14, 130–40, 55–28, 180, 130, 130–65, 45, , , 90, 65, 60, 50, 45, 40, 32, 20, 45 /40– 32 /28, 12 / 14, 180 – 90 / 55, 45 /40– 32 /28, 8 / 14, , , 20, , 25, , 25, , 25, 20 and under, 20 and under, 30 and under, , , 10 / 14 / 22, 10 / 14 / 22, 7 / 10 / 14, 7 / 10 / 14, 14 / 22 / 65, 45, 22 / 32, 7 / 10, 32 / 45, 14 / 65 / 90, 10 / 22 / 45, 65, 14 / 22, 65 . 45, 65 , 90, 65 , 90, 40, 15, 90 , 70 , 22, 90 , 70 , 22, 90 , 70 , 22, 28, 180, 90, 65, , , , , , , 46, , , 150– 28, , , 20, 20, 16, 16, 20, 16, 16, 16, 16, 16, 16, 20, , , , , , , 5, , 65, 90 , 65 , 45 , 32 , 28, 7, 10, 65 – 11, 65 – 7, 14, 20, 19, 17, 22 – 45, 22 – 45, 22 – 45, 40 , 65 , 90 , 110 , 130, 12 / 14 / 22 / 28, 90 – 22 , 14, 65 , 45 , 32 , 22, 22, 70, , 193, 55, 40, 28, , , , , , , 90, 180–130, 65]
False
200 150 200 200 200 200 200 200 300 300 300 150, 200, 300 200 200 300 300 200 150/200 150 200 200 200 300 300 300 300 200 300 300 300 300 200 200 300 300 200 300 200 300 300 300 300 300 300 300 300 200 200 300 300 300 300 300 300 300 300 300 300 300 300 300 200, 300 200 200 300 300 300 300 125/200 100 100, 150 150 100150 100, 150, 200 100, 150 200 200/150 150 150 200 150 150 150 200 150 200 200 200 300 200 150 130, 150, 200 200 150 200 150 200 100, 150, 130, 76 100, 150, 130, 76 100, 150, 130, 76 100, 150, 130, 76 150 300 300 300 300 130, 150 300 300 300 300 300 200 200 100, 130, 150 200 125 150 150 200 200 300 300 300 300 300 300 150 150 150/200 100 100 76 200150 200 150, 200 200 200 130 200 150 ( GaN ), 200 200 150 100, 150 100, 150 150 150 150 150 200 150 200 150 130, 150 200 200 150, 200 200 150 100 300 300 300 200 200 200 150 200 200 200, 300 200 200 200 200 200 300 300 300 300 300 300 300 450 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 100 150 300 200 200 150, 200 200 300 200 200 200 150 ( GaN ), 200 200 200 200 200 200 150, 200 200 200 300 300 300 300 300 200 300 200 300 100/150/200/300 200/300 200/300 200/300 200 200 300 300 300 200 200 200, 300 (merged) 300 300 200 300 300 200 300 200 100, 150 150 150, 200 150 130 100, 150, 200 150 200 450–51 100 150/200 300 300 200 150 200 200 150 130 100 150 200 200 300 300 300 300 300 300 300 300 200 200 200 200 300 200 76 200 150 200 100, 150 100, 150 100, 150 200 100 100 51–300 51–300 50–100 200 76, 100 200 100, 150, 200 300 100/150
['Company', 'Plant Name', 'Plant Location', 'Plant Cost (in US$ Billions)', 'Started Production', 'Wafer Size (mm)', 'Process Technology Node (nm)', 'Production Capacity (Wafers/Month)', 'Technology / Products', 'Ended Production']
[{'Company': Soviet Union,
'Plant Name': Jupiter,
'Plant Location': Ukraine, Kiev , Pripiat,
'Plant Cost (in US$ Billions)': ,
'Started Production': 1980,
'Wafer Size (mm)': ,
'Process Technology Node (nm)': ,
'Production Capacity (Wafers/Month)': ,
'Technology / Products': Secret government semiconductor fab closed by Chernobyl disaster,
'Ended Production': 1996},
{'Company': Tower Semiconductor (formerly [[Micron Technology|Micron]]),
'Plant Name': Fab 4,
'Plant Location': Japan Japan , Nishiwaki City,
'Plant Cost (in US$ Billions)': 0.45,
'Started Production': 1992,
'Wafer Size (mm)': 200,
'Process Technology Node (nm)': 95,
'Production Capacity (Wafers/Month)': 60000,
'Technology / Products': DRAM, foundry,
'Ended Production': 2014},
{'Company': Tower Semiconductor - Tacoma,
'Plant Name': ,
'Plant Location': China, Nanjing,
'Plant Cost (in US$ Billions)': ,
'Started Production': halted, bankruptcy in June 2020,
'Wafer Size (mm)': 200, 300 (planned),
'Process Technology Node (nm)': ,
'Production Capacity (Wafers/Month)': ,
'Technology / Products': Foundry,
'Ended Production': 2020},
{'Company': Fujian Jinhua (JHICC),
'Plant Name': F2,
'Plant Location': China China , Jinjiang,
'Plant Cost (in US$ Billions)': 5.65,
'Started Production': 2018 (planned),
'Wafer Size (mm)': 300,
'Process Technology Node (nm)': 22,
'Production Capacity (Wafers/Month)': 60000,
'Technology / Products': DRAM,
'Ended Production': 2018},
{'Company': Decoma,
'Plant Name': F2,
'Plant Location': China China , Huaian,
'Plant Cost (in US$ Billions)': ,
'Started Production': Under construction,
'Wafer Size (mm)': 300,
'Process Technology Node (nm)': ,
'Production Capacity (Wafers/Month)': 20000,
'Technology / Products': ,
'Ended Production': 2020},
{'Company': Wuhan Hongxin Semiconductor Manufacturing (HSMC),
'Plant Name': ,
'Plant Location': China China , Wuhan,
'Plant Cost (in US$ Billions)': ,
'Started Production': 2019 (halted),
'Wafer Size (mm)': 300,
'Process Technology Node (nm)': 14, 7,
'Production Capacity (Wafers/Month)': ,
'Technology / Products': Foundry,
'Ended Production': 2020},
{'Company': Tsinghua Unigroup - Unigroup Guoxin (Unigroup, Xi'an UniIC Semiconductors Co., Ltd.),
'Plant Name': SZ,
'Plant Location': China China , Shenzhen,
'Plant Cost (in US$ Billions)': 12.5,
'Started Production': Planned,
'Wafer Size (mm)': 300,
'Process Technology Node (nm)': ,
'Production Capacity (Wafers/Month)': 50000,
'Technology / Products': DRAM,
'Ended Production': 2019 (just plan)},
{'Company': TSMC,
'Plant Name': Fab 1,
'Plant Location': Taiwan Taiwan , Hsinchu,
'Plant Cost (in US$ Billions)': ,
'Started Production': 1987,
'Wafer Size (mm)': 150,
'Process Technology Node (nm)': ,
'Production Capacity (Wafers/Month)': 20000,
'Technology / Products': Foundry,
'Ended Production': March 9, 2001},
{'Company': UMC,
'Plant Name': Fab 1,
'Plant Location': Japan Japan , Tateyama,
'Plant Cost (in US$ Billions)': 0.543,
'Started Production': 1997,
'Wafer Size (mm)': 200,
'Process Technology Node (nm)': ,
'Production Capacity (Wafers/Month)': 40000,
'Technology / Products': Foundry,
'Ended Production': 2012},
{'Company': SK Hynix,
'Plant Name': E-4,
'Plant Location': USA USA , OR, Eugene,
'Plant Cost (in US$ Billions)': 1.3,
'Started Production': 2007,
'Wafer Size (mm)': 200,
'Process Technology Node (nm)': ,
'Production Capacity (Wafers/Month)': 30000,
'Technology / Products': DRAM,
'Ended Production': 2008}]